For Parts Inquiries call (727) 344-9615
A Service Disabled Veteran Owned Small Business
© Copyright 2015 Integrated Publishing, Inc.

MIL-DTL-19491 Semiconductor Devices, Packaging OfThis specification covers the requirements for the preservation, packing, and container marking of semiconductor devices such as transistors and diodes \(FSC 5961\) \(see 6.1\).

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18


. . . . . . . . . . .
MIL­DTL­19491J
3.1.2 Preservation. Preservation shall be military or commercial as specified herein (see 6.2).
3.1.2.1 Military.
3.1.2.1.1 Cleaning. Semiconductor devices and accessories shall be clean or be cleaned in accordance with
MIL­STD­2073­1, if applicable.
3.1.2.1.2 Drying. Semiconductor devices and accessories shall be dry or be dried in accordance with
MIL­STD­2073­1, if applicable.
3.1.2.1.3 Preservatives. Contact preservatives shall not be used.
3.1.2.1.4 Unit packs. Semiconductor devices shall be unit packed one each and protected in accordance with the
requirements contained herein.
3.1.2.1.5 Intermediate containers. The use of intermediate containers shall be in accordance with
3.1.2.2 Commercial. Commercial packaging shall be in accordance with ASTM D3951.
3.1.3 Packing. Packing shall be level A, B, or minimal as specified in MIL­STD­2073­1 (see 6.2).
3.1.4 Marking.
3.1.4.1 Military. In addition to any special marking required by the contract or order, marking for military or
commercial levels shall be in accordance with MIL­STD­129 and, when applicable, as specified in 3.1.4.2.
3.1.4.2 Special requirements. When required by the contract or order, containers shall be marked as specified in
3.1.4.2.1 and 3.1.4.2.2.
3.1.4.2.1 ESDS electronic devices. Unit, intermediate, and exterior packs containing ESDS devices susceptible to
damage from electric field forces (see MIL­HDBK­263 for definition of electric field) shall be marked in accordance
with MIL­STD­129 requirements.
3.1.4.2.2 MIL-PRF-19500 semiconductor devices, additional marking. The unit packs of those semiconductor
devices acquired in conformance with MIL­PRF­19500, shall be additionally marked with the following:
a.
JAN prefix.
b.
Part or Identifying Number (PIN).
c.
Manufacturer's designating symbol.
d.
Assembly plant code.
e.
Lot identification code.
f.
Inspection date.
g.
Reinspection date (if reinspection is applicable).
h.
Country of origin.
i.
Serialization may be included as a serialization range of individual serialized devices.
4



For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business

© Copyright 2015 Integrated Publishing, Inc. Site Design & Marketing by Strategico.