MIL-DTL-19491 Semiconductor Devices, Packaging OfThis specification covers the requirements for the preservation, packing, and container marking of semiconductor devices such as transistors and diodes \(FSC 5961\) \(see 6.1\).

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MIL�DTL�19491J

6.5 Subject term (key word) listing.

Diode

Electrostatic discharge protection

Environmental field force protection

Packing

Physical protection

Semiconductor device

Shielding

Special marking

Transistor

6.6 Changes from previous issue. The margins of this specification are marked with vertical lines to indicate

where changes from the previous issue were made. This was done as a convenience only and the Government

assumes no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to

evaluate the requirements of this document based on the entire content irrespective of the marginal notations and

relationship to the previous issue.

Custodians:

Preparing activity:

Army � CR

DLA � CC

Navy � EC

Air Force � 85

(Project PACK�2014�002)

DLA � CC

Review activities:

Army � AR, AV, MI, SM

Navy � AS, CG, MC, OS, SA, SH

Air Force � 71, 99

DLA � DH

NOTE: The activities listed above were interested in this document as of the date of this document. Since

organizations and responsibilities can change, you should verify the currency of the information above using the

ASSIST Online database at https://assist.dla.mil.