MIL-DTL-19491 Semiconductor Devices, Packaging OfThis specification covers the requirements for the preservation, packing, and container marking of semiconductor devices such as transistors and diodes \(FSC 5961\) \(see 6.1\).

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The documentation and process conversion

INCH-POUND

measures necessary to comply with this revision

MIL�DTL�19491J

shall be completed by 18 December 2014.

19 August 2014

SUPERSEDING

MIL�DTL�19491H

28 June 2002

DETAIL SPECIFICATION

SEMICONDUCTOR DEVICES, PACKAGING OF

This specification is approved for use by all Departments

and Agencies of the Department of Defense.

1. SCOPE

1.1 Scope. This specification covers the requirements for the preservation, packing, and container marking of

semiconductor devices such as transistors and diodes (FSC 5961) (see 6.1).

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This

section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirements of documents cited in sections 3 and 4 of this

specification, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are

those cited in the solicitation or contract (see 6.2).

FEDERAL STANDARDS

FED�STD�123

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Marking for Shipment (Civil Agencies).

COMMERCIAL ITEM DESCRIPTIONS

A�A�59135

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Packaging Material, Sheet.

A�A�59136

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Cushioning Material, Packaging, Closed Cell Foam Plank.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL�DTL�117

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Bags, Heat-Sealable.

MIL�PRF�19500

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Semiconductor Devices, General Specification for.

MIL�PRF�81705

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Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable.

Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,

ATTN: VAC, P.O. Box 3990, Columbus, OH 43218�3990, or emailed to semiconductor@dla.mil. Since contact

information can change, you may want to verify the currency of this address information using the ASSIST

Online database at https://assist.dla.mil.

AMSC N/A

AREA PACK